HP
Strategic Partner
Helios Photonics Corp
Advanced packaging and optical interconnect systems for next-generation compute.
Capabilities
- Advanced packaging (2.5D / 3D)
- Co-packaged optics
- Heterogeneous integration
Products & Services
- Optical interconnect modules
- Packaging design services
- Test and validation
Certifications
- ISO 9001
- ISO 14001
Manufacturing Locations
- Austin, Texas
- Yokohama, Japan
Headquarters
Austin, Texas, United States
Operating Countries
- United States
- Japan
- Singapore
Industry
Semiconductors
Primary Country
United States
Company Size
1,200 employees
Supply-Chain Role
Tier 1 — advanced packaging and interconnect
Partnership Sought
Co-development partners in optical compute and substrate supply
Investment Sought
Series D growth capital for packaging capacity expansion